基于三维异构集成的超宽带可重构射频通道微系统

doi:10.12305/j.issn.1001-506X.2026.10.03

摘要/Abstract

摘要：

针对综合射频系统中前端多功能、微型化发展需求，研制一种基于三维异构集成技术的超宽带可重构射频通道微系统。该射频通道采用了可重构架构，具备收发模式、频率、带宽、增益等功能性能参数的快速重构能力。该微系统集成频率预选、射频预变频、宽带捷变本振、中频变频、中频处理、电源变换、时钟分配等功能于一体，结合高温共烧陶瓷基板堆叠、硅基封装堆叠、无源电路内埋等三维异构集成技术大幅提升系统集成密度，并设计了低损耗超宽带垂直互连与紧凑空间下的高电磁隔离结构，微系统整体尺寸仅为55 mm×58 mm×14 mm，共集成器件348只。样机测试结果表明，该微系统模块工作频率覆盖S~Ku波段，发射模式下最大增益大于37 dB，饱和输出功率大于8 dBm；接收高中频模式下最大增益大于41 dB，输出杂散抑制大于45 dB；接收低中频模式下最大增益大于34 dB，输出杂散抑制大于63 dB。该设计具备工作频率宽、通用性强、增益高、杂散低、集成度高等优点。

关键词: 射频微系统, 可重构, 异构集成, 高温共烧陶瓷, 微电子机械系统

Abstract:

Aiming at the development requirements of multi-function and miniaturization of front-end in integrated radio frequency system, an ultra wideband reconfigurable radio frequency channel micro system based on three-dimensional heterogeneous integration technology is developed. The radio frequency channel adopts a reconfigurable architecture, which has the ability to quickly reconstruct functional performance parameters such as transceiver modes, frequency, bandwidth, and gain. The microsystem integrates functions such as frequency pre-selection, radio frequency pre-conversion, wideband agile local oscillator, intermediate frequency frequency conversion, intermediate frequency processing, power conversion, clock distribution, etc. Combined with three-dimensional heterogeneous integration technologies such as high-temperature co-fired ceramic substrate stacking, silicon-based package stacking, passive circuit embedding, the system integration density is improved greatly. A low-loss ultra-wideband vertical interconnection and a high electromagnetic isolation structure in a compact space are designed. The overall size of the microsystem is only 55 mm × 58 mm × 14 mm, and a total of 348 devices are integrated in it. The test results of the prototype show that the operating frequency of the microsystem covers the S−Ku band; the maximum gain is more than 37 dB, and the output power is more than 8 dBm in the transmitting mode; the maximum gain is more than 41 dB and the output spurious suppression is more than 45 dB in the receiving high intermediate frequency mode; the maximum gain is more than 34 dB and the output spurious suppression is more than 63 dB in receiving low intermediate frequency mode. The design has the advantages of wide operating frequency, strong versatility, high gain, low spur, and high integration.

Key words: radio frequency microsystem, reconfigurable, heterogeneous integration, high temperature cofired ceramics, micro-electromechanical system

中图分类号:

TN 42
TN 454

李智鹏, 钟伟, 曾荣, 王平, 吕立明, 周林. 基于三维异构集成的超宽带可重构射频通道微系统[J]. 系统工程与电子技术, 2026, 48(10): 3295-3308.

Zhipeng Li, Wei Zhong, Rong Zeng, Ping Wang, Liming Lyu, Lin Zhou. Ultra-wideband reconfigurable radio frequency channel microsystem based on three-dimensional heterogeneous integration[J]. Systems Engineering and Electronics, 2026, 48(10): 3295-3308.

图/表 24

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表2

参考文献 40

1	Tavic G C, Hiltebrck C L, Evins J B, et al. The advanced multifunction RF concept[J]. IEEE Trans. on Microwave Theory and Techniques, 2005, 53 (3): 1009. doi: 10.1109/TMTT.2005.843485
2	伍光新, 李归. 综合射频一体化系统技术发展综述[J]. 现代雷达, 2023, 45 (5): 1. doi: 10.16592/j.cnki.1004-7859.2023.05.001
3	McMahon B, Lapierre R, Maccabe A, et al. ORCHESTRA: optimizable RF converged hardware expression of a scalable transmit/receive architecture[C]// IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2018: 2139.
4	Johnson A D, McMahon B, Livadaru M, et al. Phase array advantages at BAE systems[C]// IEEE 63rd International Midwest Symposium on Circuits and Systems, 2020: 428.
5	肖国尧, 廖桂生, 柯华锋, 等. 一种侦干探多功能一体化微系统设计[J]. 系统工程与电子技术, 2024, 46 (3): 868. doi: 10.12305/j.issn.1001-506X.2024.03.12
6	陈显舟, 杨旭, 周琪, 等. 多功能可重构电磁信号发射接收及处理技术[J]. 电子科技大学学报, 2023, 52 (2): 214. doi: 10.12178/1001-0548.2022089
7	Chappell W J, Naglich E J, Maxey C, et al. Putting the radio in "software-defined radio": hardware developments for adaptable RF systems[J]. Proceedings of the IEEE, 2014, 102 (3): 307. doi: 10.1109/JPROC.2014.2298491
8	Raiszadeh M, Fox J T, Wentzloff D D, et al. Reconfigurable radios: a possible solution to reduce entry costs in wireless phones[J]. Proceedings of the IEEE, 2015, 103 (3): 438. doi: 10.1109/JPROC.2015.2396903
9	You C J, Liu J, Zhang X D, et al. Reconfigurable anti-interference RF transceiver for cognitive radio application[J]. Journal of Southeast University （English Edition）, 2011, 27 (2): 123.
10	Wang Q, Wu Y L, Qi Y, et al. A reconfigurable wireless superheterodyne receiver for multi-standard communication systems[J]. International Journal of Electronics, 2023, 110 (5): 882. doi: 10.1080/00207217.2022.2067905
11	Olsson R H, Bunch K, Gordon C. Reconfigurable electronics for adaptive RF system[C]// IEEE Compound Semiconductor Integrated Circuit Symposium, 2016.
12	Olsson R H, Bunch K, Gordon C, et al. Creating a universal radio frequency front-end for elemental digital beam formed phased arrays[C]// IEEE International Symposium on Phased Array Systems and Technology, 2016.
13	Kushner L J, Sliech K W, Flewelling G M, et al. The MATRICs RF-FPGA in 180 nm SiGe-on-SOI BiCMOS[C]// IEEE Radio Frequency Integrated Circuits Symposium, 2015: 283.
14	El-Hinnawy N, Borodulin P, Ezis A, et al. Substrate agnostic monolithic integration of the inline phase-change switch technology[C]// IEEE MTT-S International Microwave Symposium, 2016.
15	Chappell W J, Hancock T M, Olsson R H. Can phase change materials put the radio into software defined radio?[C]// IEEE MTT-S International Microwave Symposium, 2018: 829.
16	Tummala R R. SOP: what is it and why? a new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade[J]. IEEE Trans. on Advanced Packaging, 2004, 27 (2): 241. doi: 10.1109/TADVP.2004.830354
17	Samanta K K. Cost-effective technologies for next-generation system on package[J]. IEEE Microwave Magazine, 2022, 23 (8): 50. doi: 10.1109/MMM.2022.3173467
18	朱健, 郁元卫, 刘鹏飞, 等. 射频三维微纳集成技术[J]. 固体电子学研究与进展, 2023, 43 (2): 101. doi: 10.19623/j.cnki.rpsse.2023.02.002
19	吴林晟, 毛军发. 从集成电路到集成系统[J]. 中国科学: 信息科学, 2023, 53 (10): 1843.
20	徐锐敏, 王欢鹏, 徐跃航. 射频微系统关键技术进展及展望[J]. 微波学报, 2023, 39 (5): 70. doi: 10.14183/j.cnki.1005-6122.202305008
21	Lu J G, Zhu H R. Engineering applications and technical challenges of active array microsystems[J]. Frontiers of Information Technology & Electronic Engineering, 2024, 25 (3): 342. doi: 10.1631/FITEE.2300401
22	Lee C, Sutono A, Han S, et al. A compact LTCC-based Ku-band transmitter module[J]. IEEE Trans. on Advanced Packaging, 2002, 25 (3): 374. doi: 10.1109/TADVP.2002.805315
23	Zhou L X, Feng W J, Wang D, et al. A compact millimeter-wave frequency conversion SOP （system on package） module based on LTCC technology[J]. IEEE Trans. on Vehicular Technology, 2020, 69 (6): 5923. doi: 10.1109/TVT.2020.2989451
24	徐仲麟, 吴林晟, 佘胜团, 等. 面向低轨卫星通信的K波段LTCC多通道集成接收前端模块[J]. 电子学报, 2022, 50 (6): 1389. doi: 10.12263/DZXB.20211023
25	Yang F, Zhang B W, Song L J, et al. A compact RF front-end SiP with improved harmonic suppression for dual polarization phased array radar[J]. IEEE Microwave and Wireless Technology Letters, 2024, 34 (3): 350. doi: 10.1109/LMWT.2023.3348571
26	Yu B, Wang Z G, Li O P, et al. A 200-GHz four-element phased-array receiver system-in-package using HTCC technology for sub-terahertz communications[J]. IEEE Trans. on Microwave Theory and Techniques, 2024, 72 (7): 3920. doi: 10.1109/TMTT.2023.3343396
27	Yu B, Wang Z G, Li O P, et al. A 200-GHz phased-array wireless communication system using HTCC system-in-package technology[J]. IEEE Trans. on Terahertz Science and Technology, 2025, 15 (1): 45. doi: 10.1109/TTHZ.2024.3499733
28	Hauhe M S, Wooldridge J J. High density packaging of X-band active array modules[J]. IEEE Trans. on Components, Packaging and Manufacturing Technology-Part B, 1997, 20 (3): 279. doi: 10.1109/96.618228
29	Li Z Q, Sun H J, Wu H J, et al. An ultra-wideband compact TR module based on 3-D packaging[J]. Electronics, 2021, 10 (12): 1435. doi: 10.3390/electronics10121435
30	张鸣一, 朱春雨, 刘文豹, 等. 基于三维集成技术的Ku波段四通道T/R模块[J]. 半导体技术, 2021, 46 (4): 286.
31	郎小元, 邹雷, 颜俊, 等. 基于SiP技术的宽带小型化锁相源设计[J]. 压电与声光, 2024, 46 (4): 443. doi: 10.11977/j.issn.1004-2474.2024.04.004
32	Brown A R, Rebeiz G M. Micromachined micropackaged filter banks[J]. IEEE Microwave and Guided Wave Letters, 1998, 8 (4): 158. doi: 10.1109/75.663518
33	侯芳, 孙超, 栾华凯, 等. 小型化硅基毫米波MEMS三维异构集成开关滤波器件[J]. 固体电子学研究与进展, 2021, 41 (5): 330. doi: 10.19623/j.cnki.rpsse.2021.05.002
34	刘卫强, 万涛, 吕苗, 等. 基于硅基堆叠SIP技术的超宽带T/R组件[J]. 微波学报, 2024, 40 (2): 74. doi: 10.14183/j.cnki.1005-6122.202402013
35	张先荣, 钟丽. 超宽带硅基射频微系统设计[J]. 电讯技术, 2024, 64 (9): 1507. doi: 10.20079/j.issn.1001-893x.231103001
36	Gao Y H, Chen D B, Xia Y H, et al. Three-dimensional silicon based SIP design of the four-channel phased array radar TR module for Ka-band applications[C]// 7th International Conference on Electronic Information and Communication Technology, 2024: 449.
37	Lu X L, Zhou S G, Wei B, et al. Three-dimensional SIP design of the four-channel RF transceiver based on silicon and ALN for X-band radar applications[J]. IEEE Trans. on Components, Packaging and Manufacturing Technology, 2023, 13 (7): 1030. doi: 10.1109/TCPMT.2023.3294477
38	Hong J S. Microstrip filters for RF/microwave applications[M]. 2nd ed. New Jersey: Wiley, 2011.
39	Gaudencio H S, Reydezel T T, Adan S. Impedance matching of traces and multilayer via transitions for on-package links[J]. IEEE Microwave and Wireless Components Letters, 2011, 21 (11): 595. doi: 10.1109/LMWC.2011.2167136
40	Liu B Y, Wang Q P, Wu W W, et al. A transceiver frequency conversion module based on 3D micropackaging technology[J]. Journal of Systems Engineering and Electronics, 2020, 31 (5): 899. doi: 10.23919/JSEE.2020.000059

参数	HTCC	高阻硅	钛合金	钼铜合金
介电常数	9.7	11.9	—	—
损耗角正切	0.003	0.003	—	—
抗折强度/Mpa	340	165	140*	1000*
杨氏模量/Gpa	280	160	116	310
热导率/（W·m⁻¹·K⁻¹）	17.4	148	22	190
热膨胀系数/（10⁻⁶·K⁻¹）	7.06	2.6	8.9	7.5

前端模块	工作频率/GHz	主要功能	工艺类型	尺寸（mm×mm×mm）	是否气密	总器件数	器件密度/cm⁻²	总MMIC数	MMIC密度/ cm⁻²
文献[22]	14~14.5	1路发射	LTCC	10×8×0.9	否	3	2.56	—	—
文献[23]	30~40	2路接收/发射变频	LTCC	35×48×3.8	否	—	—	34	2.02
文献[24]	17.7~20.2	4路接收	LTCC	28×2.8×1.35	否	41	5.2	—	—
本文	2~18	预选滤波+接收/发射变频+本振产生	HTCC+硅基MEMS	58×55×14	是	348	10.9	133	4.17

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