高光谱遥感高速成像电路电磁兼容设计

doi:10.3969/j.issn.1001-506X.2021.01.04

Abstract

Abstract:

In the field of hyperspectral remote sensing imaging, the demand of indicators for hyperspectral remote resolution, hyperspectral resolution and large width of imaging loads are improved. To solve the problem that the electromagnetic interference (EMI) of the high-speed electronics of spaceborne hyperspectral imaging is becoming more and more intensive, the target design method to enhance the electromagnetic compatibility (EMC) capability of the spaceborne hyperspectral imager is proposed, and the implementation of the load on a specific series of high resolution hyperspectral imager verified the effectiveness of the targeted design. In order to seek the theoretical methods and technical implementation methods of EMI design for high-speed hyperspectral imagers, the useful explorations is made to provide a useful reference for the design of other spaceborne high-speed imaging loads for remote sensing.

Key words: electromagnetic compatibility (EMC), EMC design, hyperspectral imager, high-speed imaging circuit

CLC Number:

TP732

Yongzheng LIU, Xuebin LIU, Wenlong LIU, Xin ZHANG, Xiaolai CHEN. Electromagnetic compatibility design of hyperspectral remote sensing high-speed imaging circuit[J]. Systems Engineering and Electronics, 2021, 43(1): 26-32.

Figures/Tables 10

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Table 1

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References 26

1	肖文光, 陈之涛. 某星载波控单机电磁兼容性设计[J]. 空军预警学院学报, 2017, 31 (3): 171- 174.
	XIAO W G , CHEN Z T . EMC design of space borne beam-steering single mchine[J]. Journal of Air Force Early Warning Academy, 2017, 31 (3): 171- 174.
2	WU P, XU Z Q, CUI M, et al. The experiment study of effects on ADC chip against radiation and electromagnetic environment[C]//Proc.of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2019: 207-209.
3	WEI L , WEI G H , PAN X D , et al. Electromagnetic compatibility prediction method under the multifrequency in-band interference environment[J]. IEEE Trans.on Electromagnetic Compatibility, 2018, 60 (2): 520- 528.
4	GAYNUTDINOVR R, CHERMOSHENTSEV S F. Virtual testing of electronic systems by electromagnetic compatibility requirements[C]//Proc.of the XIV International Scientific-technical Conference on Actual Problems of Electronics Instrument Engineering, 2018: 320-323.
5	DOBUSC H J, KUEBRICH D, DUERBAUM T, et al. Implementation of current based three-phase CM/DM noises eparation on the driveside[C]//Proc.of the International Symposium on Electromagnetic Compatibility, 2018: 220-225.
6	POWELL T, SULEN H, HEMMADY S, et al. Predictive model for extreme electromagnetic compatibility on CMOS inverters[C]//Proc.of the International Symposium on Electromagnetic Compatibility, 2018: 113-116.
7	刘永征, 孔亮, 闫鹏, 等. 基于ADDI7004的星载高光谱成像仪图像处理系统设计实现[J]. 电子器件, 2019, 42 (6): 1455- 1457.
	LIU Y Z , KONG L , YAN P , et al. Design and implementation of image processing system of space borne high-speed hyperspectral imager based on ADDI7004[J]. Chinese Journal of Electron Devices, 2019, 42 (6): 1455- 1457.
8	CHATZINEOFYTOU E G, SPANTIDEAS S T, NIKOLOPOULOS C D, et al. Decoupling of ground plane effect on low frequency magnetic and electric field measurements & modeling[C]//Proc.of the ESAW Orkshopon Aerospace EMC, 2019.
9	OUSSAMAGASS A B , WEN Y Y . Characterization of electromagnetic wave coupling with at wisted bundle of twisted wirepairs (TBTWPs) above aground plane[J]. IEEE Trans.on Electromagnetic Compatibility, 2019, 61 (11): 251- 260.
10	LANG E C, KONRAD P, LEON E M. Experimental validation of abroad band circuit model for electromagnetic-interfe-rence analysis in metal licen closures[C]//Proc.of the IEEE Symposiumon Electromagnetic Compatibility, Signal Integrity and Power Integrity, 2018: 571-576.
11	XIONG W T, JIANG M, ZHU M C, et al. Analysis of electromagnetic shielding of IC package with thin absorbing mate-rial coating inside in two different configurations[C]//Proc.of the IEEE International Symposiumon Electromagnetic Compatibility and IEEE Asia-Pacific Symposiumon Electromagnetic Compatibility, 2018: 1216-1221.
12	YANG B, HE W H, GU B X, et al. Precision all-opticalemc test technique of integrated circuits[C]//Proc.of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2019: 243-245.
13	RAMIRO A, LEONARDO C, FANO W G. Near field scanner for electromagnetic pre-compatibility tests[C]//Proc.of the Argentine Conference on Automatic Control, 2018.
14	MA J Y , MUROG A S , ENDO Y , et al. Analysis of magnetic-film-type noise suppressor integratedon transmission lines for on-chip cross talk evaluation[J]. IEEE Trans.on Magnetics, 2018, 54 (6): 2800404.
15	KOBAYASHI R, NAGAO A, ITO H, et al. Simultaneous and non-invasive probe for measuring common-mode voltage and current[C]//Proc.of the Joint International Symposiumon Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposiumon Electromagnetic Compatibility, 2019: 645-648.
16	HARBERTSD W, PEEREN G, VANHELVOORT M. If scatter-ing of a cylindrical shield in an alternating magnetic field[C]//Proc.of the International Symposiumon Electromagnetic Compatibility-EMC EUROPE, 2019: 701-706.
17	CHU N, HOU Y C, WU D Z, et al. A high-precision thermal imag-ing approach based on Bayesian inference for EMC diagnosis[C]//Proc.of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2019: 299-303.
18	XIAO J, SONG Z X, WANG J H, et al. Simulation analysis of electromagnetic shielding of electronic device chassis[C]//Proc.of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2019: 91-93.
19	KHOSHNIAT A, ABHARI R. System level electromagnetic compatibility remedy using absorbing frequency selective surfaces[C]//Proc.of the IEEE Symposiumon Electromagnetic Compatibility, Signal Integrityand Power Integrity, 2018: 368-373.
20	LEFERIN K F. Risk-based VS rule-based electromagnetic compatibility in large installations[C]//Proc.of the IEEE 4th Global Electromagnetic Compatibility Conference, 2018.
21	KOSTEREC M, KURIMSKY J, VARGOV A B. Experimental set-up for observing the influence of radio frequency electromagnetic field on the ticks[C]//Proc.of the 19th International Scientific Conference on Electric Power Engineering, 2018.
22	ZHOU J C , GUO Y D , SATYAJEE T S , et al. Measurement techniques to identify soft failures ensitivity[J]. IEEE Trans.on Electromagnetic Compatibility, 2020, 62 (4): 1007- 1016.
23	BAUER S, TURK C, RENHART W, et al. Finite element analysis of cable shields to investigate the behavior of the transfer impedance with respect of ast transients[C]//Proc.of the IEEE 23rd Workshop on Signal and Power Integrity, 2019.
24	卓红艳, 刘志强, 彭文, 等. 光学探测系统电磁屏蔽设计与应用[J]. 红外与激光工程, 2020, 49 (6): 146- 150.
	ZHUO H Y , LIU Z Q , PENG W , et al. Design and application of electromagnetic shielding of optical detection system[J]. Infrared and Laser Engineering, 2020, 49 (6): 146- 150.
25	陈磊. 军用电子设备电磁兼容性设计与试验研究[J]. 通信电源技术, 2020, 37 (4): 23- 25.
	CHEN L . Design and test of EMC in military electronic equipment[J]. Telecom Power Technology, 2020, 37 (4): 23- 25.
26	EMRE A, CEMC K, GOZDE K, et al. Experimental analysis of radiate demission limits regarding test facilities according to EN55032[C]//Proc.of the 5th International Electromagnetic Compatibility Conference, 2019.

序号	代号	试验内容	结果
1	CE101	0.03~10 kHz电源线传导发射	通过
2	CE102	0.01~10 MHz电源线传导发射	超标
3	CE107	电源线尖峰信号传导发射	通过
4	CS101	电源线传导敏感度(0.03~150 kHz)	通过
5	CS114	电缆束注入传导敏感度(0.01~200 MHz)	通过
6	CS115	电缆束注入脉冲激励传导敏感度	通过
7	CS116	电缆和电源线阻尼正弦瞬变传导敏感度(0.01~100 MHz)	通过
8	RE102	电场辐射发射(0.000 01~28 GHz)	超标
9	RS103	电场辐射敏感度(0.002~28 GHz)	通过

[1]	Yuting ZHANG, Miao XIAO, Liang ZHANG, Huaian ZHOU, Zheng LYU. EMC performance evaluation of mobile communication satellites based on near-field scanning [J]. Systems Engineering and Electronics, 2020, 42(9): 1897-1902.
[2]	Zhonghao LU, Jun XU, Mingtuan LIN. Background electromagnetic interference suppression method based on spatial cancellation for on-site test of electromagnetic radiation emission [J]. Systems Engineering and Electronics, 2020, 42(7): 1433-1438.
[3]	XU Ning, SUN Kang, HU Yuxin, GENG Xiurui. Improved endmember extraction method based on fast Gram determinant analysis for hyperspectral imagery [J]. Systems Engineering and Electronics, 2019, 41(9): 1913-1921.

Electromagnetic compatibility design of hyperspectral remote sensing high-speed imaging circuit

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