Abstract:

In the field of unmanned aerial vehicle and missile-borne integrated electronic applications, the signal processing system based on traditional discrete device design is faced with increasingly prominent problem of resource constraints. Therefore, an integrated signal processing microsystem integration design technology for multifunctional integration of reconnaissance jamming and detection is proposed, aiming at the urgent needs of multi-function, miniaturization and high-performance applications of unmanned aerial vehicle and missile-borne integrated electronic system. Based on three-dimensional stacking and other advanced packaging technology, the radio frequency direct acquisition digital-to-analog converter/analog-to-digital converter (DAC/ADC), field programmable gate array (FPGA), advanced RISC machine (ARM), double-data-rate fourth generation synchronous dynamic random access memory (DDR4 SDRAM), multiple chip package (MCP) and resistance and capacitance components are co-packaged and integrated to form a microsystem that can simultaneously complete signal processing of reconnaissance, jamming and detection functions, and construct multi-functional application scenarios and complete software and hardware testing and verification. The microsystem has some advantages in volume, weight, performance and integration. Moreover, it greatly simplifies the complex circuit design of signal processing system, and is more convenient for standardization, generalization and softwareization of the system, so it has a great application prospect.

Key words: multi-functional, microsystem, heterogeneous isomerism, three-dimensional stacking, integration of reconnaissance jamming and detection