基于元件降额设计的温度步进强化试验剖面设计
薛小锋, 徐光铎, 冯蕴雯, 刘佳奇, 高涛, 郭世玺, 张薇
Design of temperature stepping enhancement test profile based on component derating design
Xiaofeng XUE, Guangduo XU, Yunwen FENG, Jiaqi LIU, Tao GAO, Shixi GUO, Wei ZHANG
系统工程与电子技术
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2023, (12): 4073
-4083
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DOI: 10.12305/j.issn.1001-506X.2023.12.38
