基于有限元分析的弹载二次电源高加速寿命试验仿真模拟

doi:10.12305/j.issn.1001-506X.2021.04.34

Abstract

Abstract:

The high accelerated life test (HALT) is difficult to carry out and it has high requirements for equipment. To obtain a certain type of missile onboard electronic equipment operating temperature limit, based on the finite element theory in the temperature field distribution and the good results of equivalent stress analysis, a certain type of missile seeker secondary power supply is Selected as the research object, and simulation of the HALT is carried out. First, according to the three-dimensional model established by the component finite element analysis, the material parameters are defined, the mesh is divided, and the boundary conditions are set. Then, according to the design requirements of the second power supply component HALT scheme and the temperature analysis theory, the simulation test of the component HALT is carried out based on ANSYS software, and the temperature gradient distribution and equivalent stress distribution of the component under high and low temperature stepping stress loads are obtained. Finally, by analyzing the experimental results, the high and low temperature operating limits of the secondary power supply components are obtained. The simulation experiment shows that the secondary power supply component will fail due to the solder joint falling off at 135 ℃, which provides a new idea for obtaining the product reliability information through the HALT simulation experiment.

Key words: accelerated aging test, high accelerated life test, finite element, step stress, solder joint

CLC Number:

TG156
V240.2

Xin ZHANG, Jianli HAN, Yongqiang LI, Yao WANG. High accelerated life test simulation of secondary power supply on missile based on finite element analysis[J]. Systems Engineering and Electronics, 2021, 43(4): 1153-1160.

Figures/Tables 10

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Table 1

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器件	材料	密度/(kg/m³)	泊松比/(N·A^-1)	热膨胀系数/℃	弹性模量/MPa	比热容/(J·kg^-1·℃)	导热率/(W·m^-1·℃)	热功耗/mW
二极管	主体为SiO₂	1570	0.25	13 E-6	2.1E+10	500	1	45
PCB	FRT4	1413.5	0.28	15E-6	1.1E+10	650	1	0
电阻	氧化铝陶瓷	2 300	0.32	6.7E-6	7.65E+10	350	0.70	70
管脚	镀镍铜线	8 846.3	0.31	16.6-6	1.17E+11	390	3.85	0
焊点	Sn63Pb37	8 400	0.40	24.5E-6	3.05E+10	280	10	0
芯片组件	主体为BT	1 770	0.30	13 E-6	2.1E+10	500	1	20

量级/℃(低温)	焊点应力MPa	量级/℃(高温)	焊点应力MPa
0	11.6	35	4.7
-10	16.3	45	9.4
-15	18.8	55	14.1
-20	21	65	17.8
-25	23.5	75	23.5
-30	25.7	80	25.7
-35	28.2	85	28.2
-40	30.6	90	30.6
-45	32.6	95	32.6
-50	35.4	100	35.4
-55	37.3	105	37.3
—	—	110	40.1
—	—	115	41.9
—	—	120	44.8
—	—	125	46.6
—	—	130	49.5
—	—	135	51.2
—	—	140	54.2
—	—	145	55.9
—	—	150	58.9
—	—	155	60.6

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High accelerated life test simulation of secondary power supply on missile based on finite element analysis

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