基于焊层裂纹扩展的IGBT性能退化建模与分析
康锐, 陈玉冰, 文美林, 张清源, 祖天培
Modeling and analysis of IGBT performance degradation based on solder layer crack propagation
Rui KANG, Yubing CHEN, Meilin WEN, Qingyuan ZHANG, Tianpei ZU
系统工程与电子技术
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2024, (9): 3031
-3039
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DOI: 10.12305/j.issn.1001-506X.2024.09.15
