Modeling and analysis of IGBT performance degradation based on solder layer crack propagation
Rui KANG, Yubing CHEN, Meilin WEN, Qingyuan ZHANG, Tianpei ZU
Systems Engineering and Electronics . 2024, (9): 3031 -3039 .  DOI: 10.12305/j.issn.1001-506X.2024.09.15