XIAO Yingying1,2, LIN Tingyu1,2, LI Bohu2,3, HOU Baocun1,2,3, SHI Guoqiang1,2,3
(1. Beijing Complex Product Advanced Manufacturing Engineering Research Center, Beijing Simulation
Center, Beijing 100854; 2. State Key Laboratory of Intelligent Manufacturing System Technology,
Beijing Institute of Electronic System Engineering, Beijing 100854; 3. Science and Technology on
Space System Simulation Laboratory, Beijing Simulation Center, Beijing 100854)